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Gembird TG-G3.0-01 heat sink compound 4.5 W/m·K 3 g

SKU
TG-G3.0-01
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In Stock: 10 available
Heatsink thermal paste grease, 3 g weight
  • Keep your computer's CPU cool
  • Practical syringe for easy application
Category: Heat Sink Compounds
More Information
SKU TG-G3.0-01
EAN 8716309083133
Manufacturer Gembird
Availability In Stock
Reviews
Description
Thermal compund (grease) for heatsinks
Helps the heat dissipation from a CPU, chipset or processor to a heatsink
Excellent thermal impedance
Perfect stability - will not separate, run, migrate, or bleed
Non capacitive or electrically conductive
Specifications
Features
Thermal resistance0.205 °C/W
Viscosity note76 CPS
Thermal conductivity4.5 W/m·K
Operating temperature (T-T)-50 - 240 °C
Product colourGrey
Technical details
Compliance certificatesRoHS
Thermal resistance0.205 °C/W
Viscosity note76 CPS
Thermal conductivity4.5 W/m·K
Operating temperature (T-T)-50 - 240 °C
Weight & dimensions
Width120 mm
Depth180 mm
Height15 mm
Weight3 g
Package width120 mm
Package depth180 mm
Package height15 mm
Package weight33 g
Packaging data
Package width120 mm
Package depth180 mm
Package height15 mm
Package weight33 g
Operational conditions
Operating temperature (T-T)-50 - 240 °C
Colour
Product colourGrey

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SKU
TG-G3.0-01
HTK-002-U1-GP
701662
ACTCP00002B
ACTCP00001B
CT-9010001-WW
Manufacturer
Gembird
Cooler Master
Manhattan
ARCTIC
ARCTIC
Corsair
Type
N/A
Thermal paste
Thermal paste
Thermal paste
Thermal paste
Thermal paste