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Noctua NT-H1 heat sink compound Thermal paste 3.5 g
SKU
NT-H1 3.5G SW EDITION
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In Stock:
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High-grade thermal compound, Spatula + 3x NA-CW1 cleaning wipes, 2.49 g/cm³, 1.4 ml, 3.5 g, grey
Category: Heat Sink Compounds
| Type | Thermal paste |
|---|---|
| SKU | NT-H1 3.5G SW EDITION |
| EAN | 9010018201345 |
| Manufacturer | Noctua |
| Availability | Out of Stock |
SW (Spatula & Wipes) Edition
The SW (Spatula & Wipes) Edition includes a spatula for users who prefer to manually spread the paste before installing the heatsink as well as three NA-CW1 cleaning wipes for pre-application cleaning and easy removal.
Not electrically conductive, non-corroding
While some high-end thermal compounds and pads are risky to use due to their electrical conductivity or corroding properties, there’s no risk of short-circuits with NT-H1 and it’s completely safe to use with any type of CPU cooler, regardless of whether it’s made from copper or aluminium and whether it’s nickel-plated or not.
Excellent long-term stability
NT-H1's unique formula is highly stable over time, even after longer periods of usage. It can be stored at room temperature for at least 3 years and due to the compound’s exceptional curing, bleeding, dry-out and thermal cycling characteristics, it can be used on the CPU for 5 years or more.
No break-in or burn-in required
Some thermal compounds need a longer break-in period or cure time until they reach their full performance and some thermal pads must undergo a dedicated burn-in process. By contrast, NT-H1 is ready to go right away and doesn’t require any special preparations.
The SW (Spatula & Wipes) Edition includes a spatula for users who prefer to manually spread the paste before installing the heatsink as well as three NA-CW1 cleaning wipes for pre-application cleaning and easy removal.
Not electrically conductive, non-corroding
While some high-end thermal compounds and pads are risky to use due to their electrical conductivity or corroding properties, there’s no risk of short-circuits with NT-H1 and it’s completely safe to use with any type of CPU cooler, regardless of whether it’s made from copper or aluminium and whether it’s nickel-plated or not.
Excellent long-term stability
NT-H1's unique formula is highly stable over time, even after longer periods of usage. It can be stored at room temperature for at least 3 years and due to the compound’s exceptional curing, bleeding, dry-out and thermal cycling characteristics, it can be used on the CPU for 5 years or more.
No break-in or burn-in required
Some thermal compounds need a longer break-in period or cure time until they reach their full performance and some thermal pads must undergo a dedicated burn-in process. By contrast, NT-H1 is ready to go right away and doesn’t require any special preparations.
| Features | |
|---|---|
| Type | Thermal paste |
| Density | 2.49 g/cm³ |
| Operating temperature (T-T) | -50 - 110 °C |
| Product colour | Grey |
| Weight & dimensions | |
| Volume | 1.4 ml |
| Weight | 3.5 g |
| Package width | 70 mm |
| Package depth | 30 mm |
| Package height | 57 mm |
| Packaging data | |
| Package width | 70 mm |
| Package depth | 30 mm |
| Package height | 57 mm |
| Quantity per pack | 1 pc(s) |
| Scraper | Yes |
| Degreaser included | Yes |
| Technical details | |
|---|---|
| Volume | 1.4 ml |
| Density | 2.49 g/cm³ |
| Operating temperature (T-T) | -50 - 110 °C |
| Operational conditions | |
| Operating temperature (T-T) | -50 - 110 °C |
| Colour | |
| Product colour | Grey |
| Logistics data | |
| Quantity per pack | 1 pc(s) |