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ARCTIC TP-4 Premium Performance Thermal Pad
SKU
ACTPD00062A
Category: Heat Sink Compounds
| SKU | ACTPD00062A |
|---|---|
| Manufacturer | ARCTIC |
| Availability | Out of Stock |
| Product Manuals (HTML) |
View Manual |
| PDF URLs |
View PDF |
High Performance — Extremely Soft
The silicone-based TP-4 combines high thermal conductivity with extremely low hardness and reliably compensates for manufacturing tolerances between chips.
Safe Application
Electrically insulating, non-adhesive, and easy to handle — for safe and reliable heat transfer.
Minimizing Thermal Resistance
The thinner the pad, the lower the thermal resistance. Depending on mounting pressure, the TP-4 can be compressed to up to 60% of its original thickness.
Bridging Uneven Surfaces
Adapts optimally to varying chip heights, air gaps, and uneven surfaces to ensure reliable contact.
Available in Various Thicknesses and Sizes
Available in 0.5 mm, 1.0 mm, and 1.5 mm thicknesses as well as multiple sizes. Can be individually cut to size if needed.
Stackable Without Performance Loss
Thanks to its low hardness and low interface resistance, multiple pads can be combined without affecting thermal transfer performance.
Versatile Applications
Ideal for RAM, chipsets, GPUs, consoles, laptops, and many other electronic components. Flexible, vibration-dampening, and easy to cut.
The silicone-based TP-4 combines high thermal conductivity with extremely low hardness and reliably compensates for manufacturing tolerances between chips.
Safe Application
Electrically insulating, non-adhesive, and easy to handle — for safe and reliable heat transfer.
Minimizing Thermal Resistance
The thinner the pad, the lower the thermal resistance. Depending on mounting pressure, the TP-4 can be compressed to up to 60% of its original thickness.
Bridging Uneven Surfaces
Adapts optimally to varying chip heights, air gaps, and uneven surfaces to ensure reliable contact.
Available in Various Thicknesses and Sizes
Available in 0.5 mm, 1.0 mm, and 1.5 mm thicknesses as well as multiple sizes. Can be individually cut to size if needed.
Stackable Without Performance Loss
Thanks to its low hardness and low interface resistance, multiple pads can be combined without affecting thermal transfer performance.
Versatile Applications
Ideal for RAM, chipsets, GPUs, consoles, laptops, and many other electronic components. Flexible, vibration-dampening, and easy to cut.
| Features | |
|---|---|
| Type | Thermal pad |
| Density | 3.4 g/cm³ |
| Operating temperature (T-T) | -40 - 200 °C |
| Product colour | Grey |
| Technical details | |
| Warranty period | 6 year(s) |
| Compliance certificates | UL, RoHS |
| Density | 3.4 g/cm³ |
| Operating temperature (T-T) | -40 - 200 °C |
| Weight & dimensions | |
| Width | 100 mm |
| Depth | 100 mm |
| Height | 0.5 mm |
| Package width | 115 mm |
| Package depth | 120 mm |
| Package height | 1.5 mm |
| Package weight | 31 g |
| Packaging data | |
|---|---|
| Package width | 115 mm |
| Package depth | 120 mm |
| Package height | 1.5 mm |
| Package weight | 31 g |
| Quantity per pack | 1 pc(s) |
| Operational conditions | |
| Operating temperature (T-T) | -40 - 200 °C |
| Colour | |
| Product colour | Grey |
| Logistics data | |
| Country of origin | China |
| Quantity per pack | 1 pc(s) |