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Akasa Pro-grade+ 5026 heat sink compound 2.9 W/m·K 3 g
SKU
AK-TC5026
- Outperformed similar compounds when the CPU was under load
- Thermally conductive technology behind Akasa’s fanless case evolution
- Ultra-thin bond lines & lo-thermal resistance for superior thermal performance
- Non-electrically conductive & non pressure dependant compound
- RoHS compliant
- Easy-to-use syringe applicator and spreader
Category: Heat Sink Compounds
| SKU | AK-TC5026 |
|---|---|
| EAN | 4710614539358 |
| Manufacturer | Akasa |
| Availability | Out of Stock |
| Product Manuals (HTML) |
View Manual |
Excellent thermal performance, even at lo-pressures.
When every degree matters, get more from your cooler. Pro-grade+ silicone-tech evolution 5026 provides ultra thin bond lines, hi-thermal conductivity and hi-temperature stability, creating the ultimate thermal compound. It’s suitable for all CPUs and applications, from fanless cases to hi-performance coolers.
When every degree matters, get more from your cooler. Pro-grade+ silicone-tech evolution 5026 provides ultra thin bond lines, hi-thermal conductivity and hi-temperature stability, creating the ultimate thermal compound. It’s suitable for all CPUs and applications, from fanless cases to hi-performance coolers.
| Features | |
|---|---|
| Constitutive ingredients | Silicone |
| Thermal resistance | 0.03 °C/W |
| Thermal conductivity | 2.9 W/m·K |
| Operating temperature (T-T) | -45 - 200 °C |
| Product colour | Grey |
| Specific gravity | 3.23 g/cm³ |
| Technical details | |
| Compliance certificates | RoHS |
| Constitutive ingredients | Silicone |
| Thermal resistance | 0.03 °C/W |
| Thermal conductivity | 2.9 W/m·K |
| Operating temperature (T-T) | -45 - 200 °C |
| Weight & dimensions | |
| Weight | 3 g |
| Packaging data | |
|---|---|
| Quantity per pack | 1 pc(s) |
| Operational conditions | |
| Operating temperature (T-T) | -45 - 200 °C |
| Colour | |
| Product colour | Grey |
| Logistics data | |
| Quantity per pack | 1 pc(s) |