XPG Lancer Blade memory module 32 GB 2 x 16 GB DDR5 6400 MT/s 288-pin DIMM ECC

SKU
AX5U6400C3216G-DTLABWH
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32 GB(16 x 2), DDR5, 6400 MT/s, CL 32, XMP 3.0, AMD EXPO, ECC, White
  • Compact Low-Profile Heatsink Design
  • PMIC for power supply stability
  • On-die ECC error correction
  • High-quality materials for stable overclocking
  • Works with the Latest AMD Platforms
  • Supports Intel® XMP 3.0 and AMD EXPO for easy overclocking
More Information
SKU AX5U6400C3216G-DTLABWH
EAN 4711085944634
Manufacturer ADATA
Availability Out of Stock
PDF URLs View PDF
LANCER BLADE DDR5
SLEEK EFFICIENCY, COMPACT POWER


Compact Low-Profile Heatsink Design
The LANCER BLADE boasts a low-profile heatsink that fits perfectly in smaller PC cases and avoids interference with tower CPU coolers. Its sleek geometric lines add versatility and visual appeal to any case design.

Enhanced Power Management
The XPG LANCER BLADE DDR5 features a built-in Power Management IC (PMIC) that enhance power supply stability. It's lower operating voltage also make LANCER more power-efficient than DDR4.

Stability and Reliability
With On-die error correcting code (ECC), this DDR5 memory module can correct errors in real-time to provide increased stability and reliability.

Made with High-Quality Materials
High-quality ICs and PCBs ensure uncompromised performance and reliable overclocking, ideal for discerning gamers and overclockers.

AMD EXPO
Support for AMD EXPO (EXtended Profiles for Overclocking) and compatibility with the latest platforms for reliability and stability.

Overclocking Made Easy
With support for Intel XMP 3.0, get overclocking easily without the need to hassle with BIOS settings. There is no need to repeatedly adjust and fine-tune overclocking parameters.
Memory
Package typeBlister
Intel Extreme Memory Profile (XMP)Yes
Intel Extreme Memory Profile (XMP) version3.0
Memory layout (modules x size)2 x 16 GB
Internal memory32 GB
Component forPC
Memory form factor288-pin DIMM
CAS latency32
ECCYes
Internal memory typeDDR5
Design
Cooling typeHeatsink
Technical details
Cooling typeHeatsink
Features
On-Die ECCYes
Intel Extreme Memory Profile (XMP)Yes
Intel Extreme Memory Profile (XMP) version3.0
Memory layout (modules x size)2 x 16 GB
Internal memory32 GB
Component forPC
Memory form factor288-pin DIMM
CAS latency32
Cooling typeHeatsink
ECCYes
Internal memory typeDDR5
AMD Extended Profiles for Overclocking (EXPO)Yes
Memory data transfer rate6400 MT/s
Operational conditions
Operating temperature (T-T)0 - 85 °C
Storage temperature (T-T)-20 - 65 °C
Weight & dimensions
Package width141 mm
Package depth170 mm
Package height12.2 mm
Width133.3 mm
Depth33.8 mm
Height7.8 mm
Weight36.2 g
Package typeBlister
Package weight113 g
Packaging data
Package width141 mm
Package depth170 mm
Package height12.2 mm
Package typeBlister
Package weight113 g